EVG5206"EVG 520 Wafer Bonde
- Model: EVG 520
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Capable of anodic bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Wafer size: up to 150mm capable
- Vacuum chuck: 6"/150mm diameter chuck
- Max Bond Force: 7 kN
- Top side heater: 550°C max.