EVG5108"EVG 510 Wafer Bonder
- Model: 510 Wafer Bonder - Manual wafer load substrate bonder - Capable of fusion
compression bonding - Capable of thermal compression bonding - Ideal for R&D and
pilot production applications - High-vacuum capable bond chamber - Windows based
control software and operation interface - Wafer size: up to 8”/200mm capable - Max
Bond Force: 10 kN - Top side heater: 550°C max. in 1°C steps - Bottom side heater:
550°C max. in 1°C steps - Temperature uniformity: ± 1,5 %Tu